Company job tracker
Build your next chapter at Micron Technology.
Every live Micron Technology role we are tracking, collected in one focused shortlist.
200 recent public openings
instahyre
linkedin
naukri
smartrecruiters
workday
Open roles
Newest openings first. Select a role for the full listing and direct application link.
Showing the latest 200 public results, up to 200. Search filters this displayed list.
RDA Principal Lead Engineer
Engineer, DDEG Design Methodology
Principal/Staff/Senior Engineer, Package Characterization - APTD
Engineer - STPG PE NAND
Principal/Staff Engineer, PCVD Film Deposition, TD
Engineer/Senior Engineer, HIG-HBM Product System & Engineering (Media Health Manufacturing)
Staff Engineer - SSD PDT Lead
Staff Engineer, IP Dev Layout
Senior layout Engineer – DPG Layout
DRAM Principal Design Verification Engineer
Senior Design Verification Engineer/Architect, HBM
Talent Acquisition - Contract Recruiter
Senior Dry Etch Process Engineer
Intern - ATE Process Engineer, PCVD ID1
ASIC Analog Layout Engineer
NCG DRAM Design Technology Layout Engineer
Process Integration DRAM, PI Engineer
Engineer/Senior Engineer, Product & System Engineering (Media Health Reliability), Heteregenous Integration - High Bandwidth Memory
HBM SoC Physical Design Engineer
Director, Sales Strategy and Planning
DATA SCIENTIST, SMAI OI (AI Solutions Development)
AI Reimagination Engineer
Senior Engineer – Process Development, Photolithography, NAND
Senior Engineer – Process Development, Dry Etch NAND
SR PRINCIPAL GSM, FE PRO GLOBAL CAPITAL
SNR/STAFF SHIFT ENGINEER LEAD, TD MFG DEV ENGG
SHIFT ENGINEER, TD MFG DEV ENGG
SENIOR/ STAFF ENGINEER, FE OCT, MTE PAC
Quality Technician
Quality Technician (Audit)
Quality Management System Engineer
QUALITY TECHNICIAN SPECIALIST
Product Quality Assurance Engineer
Product Integration Lead, HIG High Bandwidth Memory
Process Integration & Yield Enhancement Engineer
Process Integration & Yield Enhancement Engineer
Process Control Engineer (Systems)
Process & Equipment Engineer
Process & Equipment Engineer Fab Support
Probe Manufacturing Shift Engineer
Probe Integration Engineer (Test Solutions Engineering)
Principal/Staff Engineer, FE OCT TIQ
Principal/Staff Engineer, FE OCT Materials Cost
Senior Engineer, APTD CEM - Advanced Packaging Wafer Level Technology Engineering
Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering
Senior Engineer Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering
Senior Engineer, Advanced Package Metrology-Real-Time Defect Analysis
Principal Engineer/MTS, Process Development, Photolithography, NAND
Principal Engineer, NAND Advanced Thin Films Process Development
Principal Engineer – Process Development, Wet, NAND
Principal Engineer – Process Development, Thin Film (CVD/Diffusion), NAND
Principal Engineer – Process Development, Photolithography, NAND
Principal Engineer – Process Development, Dry Etch, NAND
Principal Engineer – Process Development, Cell Film, NAND
Principal Engineer, (NAND Cell Film Process)
Principal, Global Leadership & Organization Capability
Planning Engineer
Planning Assistant
Senior/Staff Engineer, Process Development, Photolithography, NAND
Senior/Distinguished Member of Technical Staff, Process Development, Photolithography, NAND
Package Health Yield (Senior/Staff/Principal) Engineer, APTD
Package Development Engineering – Product Integration Engineer (PDE PIE)
Package Characterization Lab Manager, APTD
PROBE AREA ENGINEER
PRINCIPAL ENGINEER - OCT FE PEE WET PROCESS
PRINCIPAL ENGINEER – FE OCT CPEE HVM DRY ETCH
Operations Improvement Engineer
OCT CPEE CMP STAFF/PRINCIPAL ENGINEER
New Product Introduction (NPI) Planning Engineer
NAND Reliability Product Engineer
Metrology & Real-Time Defect Analysis Technician
Member of Technical Staff, NAND Advanced Thin Films Process Development
Member of Technical Staff (MTS), NAND Cell Film
Member of Technical Staff (MTS) – Process Development, WET, NAND
Member of Technical Staff (MTS) – Process Development, Thin Films (CVD/Diffusion), NAND
Member of Technical Staff (MTS) – Process Development, Photolithography, NAND
Member of Technical Staff (MTS) – Process Development, Dry Etch, NAND
Member of Technical Staff (MTS) – Process Development, Cell Film, NAND
Material Handler
Manufacturing Technician
Manufacturing Equipment/Production Engineer
Manufacturing Equipment/Production Engineer
MTS/Principal Engineer, Wet Process Engineering, NAND Advance Node
MSB Process & Equipment (PEE) Technician
MSB PRODUCTION OPERATOR
Lean Manufacturing Engineer
Staff Engineer – Process Development, Wet, NAND
Intern- Solutions Engineer
Industrial Engineer
Incoming Quality Control Engineer
IE Layout Engineer
Frontend Central Product Integration Engineering (cPIE) Transformative HVB (high-value-bits) Engineer/Senior Engineer
Front End Central Product Integration (FE cPIE) Principal Engineer/Senior Manager
Firmware Engineer
Facilities Tool Install Technician
Facilities Technician
Facilities Operations Technicians
Facilities Mechanical Technician
Facilities Electrical Technician
Facilities Building Services Technician
FACILITIES ENGINEER - ELECTRICAL
FACILITIES ENGINEER - CONTROL
FACILITIES ENGINEER - BUILDING SERVICES
FAC ENGINEER - UPW & WWTP
F10 Receiving and Shipping Specialist
F10 Planning Site Inventory Control (SIC) Engineer
F10 PROBE AUTOMATION ENGINEER
Equipment Technician
Equipment Technician
Environment Health Safety Engineer - Safety
Senior Engineer, APTD Operations
Engineering Execution Manager, HIG High Bandwidth Memory (HBM)
Engineer/Senior Engineer in Product Engineering, NAND Validation/Characterization
Engineer, Yield Enhancement
Engineer, Yield Enhancement
Engineer, Yield Enhancement
Engineer, Yield Enhancement PDE (Package Development Engineering)
Engineer, Yield Enhancement Laboratory
Engineer, Yield Enhancement Laboratory
Engineer, Test Solutions
Engineer, Strategic Program Management Office, Workforce Development
Engineer, Shift Manufacturing
Engineer, Real Time Defect Analysis
Engineer, Real Time Defect Analysis
Engineer, Quality Metro Real-time Defect Analysis
Engineer, Product & System Engineering (Media Health Manufacturing), Heterogenous Integration - High Bandwidth Memory
Engineer, Product Development Engineering Key Equipment Group (PDE KEG)
Engineer, Process and Equipment Engineering
Engineer, Process Integration
Engineer, Process Integration
Engineer, Process Integration PDE (Package Development Engineering)
Engineer, Process Development (Core Engineering Module)
Engineer, Process Control System
Engineer, Metrology
Engineer, Metrology & Real Time Defects Analysis
Engineer, Metrology & Real Time Defects Analysis
Engineer, Metro Real-time Defect Analysis (RDA) Process & Equipment
Engineer, Material
Engineer, HIG-HBM Product System & Engineering (Media Health Reliability)
Engineer, HIG-HBM Product System & Engineering (Media Health Reliability Coding)
Engineer, HIG-HBM Product System & Engineering (Media Health Manufacturing)
Engineer, Facilities Tool Install
Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering
Engineer, APTD CEM – Advanced Packaging Wafer Level Technology Engineering
Engineer, APTD CEM - Advanced Packaging Integration Engineering
Engineer, APTD CEM - Advanced Packaging Equipment Engineering
Engineer - QEM QDM
Engineer - QEM Process Control System(PCS)
Engineer - QEM PRODUCT QUALITY ENGINEERING YIELD
Engineer - QEM PRODUCT QUALITY ENGINEERING (PQE)
Engineer - QEM PQE Electrical Failure Analysis
Engineer - QEM PQE Electrical Failure Analysis
Engineer - QEM Incoming Quality Control
Engineer - QEM Incoming Quality Control
Engineer - QEM Contamination Control (Environment/Process)
Engineer - Planning (Materials and Spares Planning)
Engineer - Change Management
Engineer - APTD Operations
ENGINEER, High Bandwidth Memory (HBM) & New Product Introduction (NPI)
ENGINEER, High Bandwidth Memory (HBM) & New Product Introduction (NPI)
ENGINEER, F10 SPM PMO
ENGINEER, F10 DAST AUTOMATION
ENGINEER - QEM CHEMLAB
ENGINEER - Planning (Operations Modelling)
ENGINEER - Planning (Layout)
ENGINEER - PROBE SOFTWARE & ANALYTICAL
ENGINEER - PROBE SHIFT EQUIPMENT
ENGINEER - PROBE SHIFT EQUIPMENT
ENGINEER - PLN Operation Intelligence
ENGINEER - PLN Operation Intelligence
ENGINEER - PLANNING IE
ENGINEER - FACILITIES OPERATION
ENGINEER - FACILITIES CHEMICAL AND GAS
ENGINEER - F10 FAC MECHANICAL
Dry Etch Staff/Principal Engineer - Advanced NAND
Dry Etch Senior/Staff Engineer
Dry Etch Senior Engineer, Advance NAND
Dry Etch - SMTS, PD, Advance NAND
Dry Etch - MTS, PD, Advance NAND
Dry Etch - DMTS, PD, Advance NAND
Distinguished Member of Technical Staff, NAND Advanced Thin Films Process Development
Distinguished Member of Technical Staff (DMTS), NAND CELL FILM PROCESS
Distinguished Member of Technical Staff (DMTS) – Process Development, Wet, NAND
Distinguished Member of Technical Staff (DMTS) – Process Development, Thin Films (CVD/Diffusion), NAND
Distinguished Member of Technical Staff (DMTS) – Process Development, Photolithography, NAND
Distinguished Member of Technical Staff (DMTS) – Process Development, Dry Etch, NAND
Distinguished Member of Technical Staff (DMTS) – Process Development, Cell Film, NAND
Distinguished Member of Technical Staff (DMTS) – Process Development, CMP, NAND
Director, Global Facilities & Construction, South Asia
Director, FE OCT CPEE Photo
Cost Engineer
Contamination Control and ESD Engineer
Automation Equipment Technician
Automation Engineer
Engineer- DRAM, Advanced DRAM and EM Device/Cell Technology
Staff Product Owner, SMAI, FE Cost
SMTS, Systems Infrastructure Engineering
Principal Firmware Developer, HBM
Staff Engineer - SSD PDT Lead
Sr. SIEM Engineer
No matching roles
Alert me when Micron Technology posts →
Try another title or location.
Your next job should find you first.
Set your preferences once. JobBeeper watches the market and sends fresh matches in minutes.
Create my free alert →