Principal Signal Integrity Engineer

Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Principal Signal Integrity Engineer — Interface PathfindingAbout the Role
At Micron, we transform how the world uses information to enrich life for all. As a global leader in memory and storage innovation, we develop technologies that accelerate intelligence and enable the next era of AI, ML, and advanced computing.
Micron’s Interface Pathfinding team operates at the leading edge of that mission — serving as a bridge between corporate strategy and engineering through forward-looking investigation and development of energy-efficient bandwidth solutions. Our work spans innovative circuit, signaling, packaging, and interconnect solutions with a 3–5 year technology horizon, grounded in rigorous analysis, hands-on measurement, and a commitment to building a robust intellectual property portfolio.
As a Principal Signal Integrity Engineer, you will be a core technical contributor on a deliberately small, senior team united around the goal of preparing high-speed interface innovations for high-confidence product adoption.
What You’ll Work On
Micron’s Interface Pathfinding team investigates and validates novel interconnect and signaling solutions for high-speed memory and die-to-die interfaces. The signal integrity scope is broad and analytically deep — spanning electrical modeling, channel analysis, and substrate evaluation — with an emphasis on original analysis rather than execution of established playbooks.
Key signal integrity domains include:
Interconnect Modeling — Generating and validating electrical models for packages, substrates, and interconnects used in forward-looking feasibility studies
Substrate & Packaging Evaluation — Assessing next-generation substrate technologies and providing strategic direction on their signal integrity implications
Channel & I/O Co-Optimization — Performing SI analysis during feasibility studies and driving I/O + channel co-optimization, including coordination with supporting organizations
Design Rule Development — Driving progressive design rules that enable package and system-level performance scaling
Link Budgeting & Sim-to-Silicon Correlation — Establishing forward-looking link budgets and developing methodologies that connect simulation predictions to measured silicon outcomes
What You’ll Own
Interconnect Modeling: Own the generation and validation of interconnect models — from field solver extraction through time- and frequency-domain circuit simulation — serving as the authoritative source for model quality on the team.
Technology Evaluation: Lead SI assessment of forward-looking substrate and packaging technologies, translating physical characteristics into channel performance projections and strategic recommendations.
Feasibility Analysis: Drive SI analysis during pathfinding studies, including I/O and channel co-optimization, and provide direction to supporting organizations when analysis is distributed.
Design Rule Definition: Develop and champion progressive package and system-level design rules grounded in electromagnetic analysis and simulation data.
Link Budgeting: Define forward-looking link budgets and establish the sim-to-silicon correlation methodologies that give the team and product programs confidence in pre-silicon predictions.
Cross-Disciplinary Engagement: Collaborate across Signal Integrity, Circuit and Chip Design, Packaging R&D, and System Integration — translating SI findings into actionable guidance for partner teams.
Design Documentation: Author analysis reports, modeling methodology documents, and design rule specifications that serve as the authoritative reference for the team and follow-on programs.
What You Bring
Required
MS or PhD in Electrical Engineering or related field (MS with strong electromagnetic/SI fundamentals accepted; PhD preferred but not sufficient on its own — demonstrated hands-on modeling and simulation capability is what differentiates)
10+ years of industry experience in signal or power integrity analysis applied to high-speed interface technologies
Extensive experience applying electromagnetic and transmission line theory to SI/PI analysis of differential and single-ended interfaces
Extensive experience with time- and frequency-domain simulation tools — ADS, HSPICE, SPECTRE, or equivalent
Deep experience with electromagnetic field solvers — Q3D, SIWAVE, HFSS, or equivalent — including solver setup, mesh strategy, and result validation
Working knowledge of hardware measurement tools — oscilloscopes, TDR, VNA — and their application to SI characterization
Comfortable with broad ownership, cross-discipline collaboration, and making analytical decisions with real program consequences
Strong written and verbal communication skills — this role produces modeling reports, link budgets, and design rule documents
Preferred
Familiarity with memory I/O architectures and their signal integrity constraints
Experience with advanced packaging technologies — 2.5D/3D integration, embedded die, or high-density organic substrates — and their electromagnetic modeling challenges
Post-silicon characterization experience — correlating simulation predictions to measured TDR, insertion loss, eye diagrams, or BER results
Some familiarity with modeling optical links
Willingness to learn and apply Artificial Intelligence -based methods to streamline modeling and simulation workflows
Prior experience in a pathfinding or advanced development environment where analysis methodology is actively developed, not inherited
Why This Role
You will do original signal integrity analysis on problems that matter — developing the interconnect models and channel solutions that define what high-speed memory and die-to-die interfaces can achieve.
You will work alongside genuinely exceptional engineers — spanning analog design, chip design, packaging R&D, and system integration — in an environment where SI analysis directly shapes architectural decisions.
The team is intentionally small and senior — decisions get made quickly, bureaucracy is minimal, and your technical judgment will be trusted.
You are joining an active program with real momentum — your analytical leadership will directly shape its trajectory and scope.
This is a long-term opportunity — strong execution early creates compounding impact as the program scales.
A Note to All Candidates
This role is part of a deliberate effort to build a long-term, high-caliber team around a compelling high-speed interface technology program. We are looking for engineers who want to own something, build something, and grow with a program. If that description resonates, we’d like to hear from you.
As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
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To learn more about Micron, please visit micron.com/careers
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