Staff/Principal, APTD CEM - Advanced Packaging Wafer Level Technology Engineering

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Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.
Role Summary:
We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing.
Your responsibilities include but are not limited to developing and enabling deployment of processes related to the post-fab wafer finishing processes in semiconductor manufacturing to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration flows for solutions that drive the future.
Main Responsibilities:
Process Development:
Establish and improve Wafer level process conditions and technologies (wafer thinning, backside metal interconnect)
Upgrade process capabilities and reduce production costs
Establish and improve process management projects to deliver technology node requirements and scaling for next node.
Equipment and Materials:
Evaluate and promote new equipment and materials to enhance process capabilities
Set up process parameters for a variety of semiconductor equipment
Evaluate, promote, and plan for new equipment and materials
Quality Improvement:
Ensure defense coverage through process, measurement, inspection, and testing
Establish correlations between defense mechanisms to identify improvement opportunities
Conduct continuous data analysis to establish advanced controls and identify improvement opportunities
Collaboration and Coordination:
Work closely with internal and external partners to build and execute technology development strategies aligned with organizational and business objectives
Work closely with various teams, including the Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control
Ensure smooth transition from new product development, qualification, small volume production to high volume production
Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities
AI Responsibilities:
Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.
Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.
Candidate Profile
Minimum Required Qualifications:
PhD with ≥2 years, or Master’s degree with ≥5 years, or Bachelor’s degree with ≥7 years of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related field.
Semiconductor process development, preferably in wafer bonding, plating, warpage control and packaging field.
Must Have Technical Skills:
Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics.
Experience with Visual Basic for automation and tool integration.
Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control.
Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding.
Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability
Must Have Soft Skills:
Strong analytical and problem-solving capabilities.
Outstanding communication, leadership, and stakeholder management skills.
Ability to work independently and collaboratively in a fast-paced environment.
Ability to work cross-functionally with process, equipment, and reliability teams.
AI Requirements:
Ability to apply baseline digital fluency and role‑appropriate AI literacy to use AI‑enabled tools responsibly and effectively for research, analysis, content creation, problem‑solving, operational tasks, and achieving business outcomes.
Embody Micron’s core values:
People – Respect, develop, and empower others
Innovation – Drive continuous improvement and breakthrough thinking
Tenacity – Show grit and determination
Collaboration – Build trust and foster teamwork
Customer Focus – Deliver excellence and value
Speed –