Master Equipment Maintenance & Preventative Maintenance Technician

ESSENTIAL DUTIES AND RESPONSIBILITIES
Responsible for sustaining, preventive maintenance (PM), setup, qualification, and conversion activities for Die Prep equipment to ensure optimum machine performance and production efficiency.
Perform hands-on troubleshooting and provide systematic root cause analysis for equipment-related issues using structured problem-solving methodologies.
Lead complex equipment troubleshooting activities and drive corrective and preventive actions through tools such as 5 Why Analysis, Fishbone Diagram, and Failure Analysis techniques.
Support and mentor junior technicians in equipment maintenance, troubleshooting, and improvement activities.
Ensure equipment uptime targets are achieved by responding effectively to major machine breakdowns and coordinating recovery actions.
Execute and oversee preventive maintenance programs, equipment upgrades, and continuous improvement initiatives to enhance reliability and productivity.
Collaborate closely with Process, Manufacturing, and Engineering teams to investigate yield excursions, process abnormalities, and equipment-related quality issues.
Drive equipment performance improvements through data analysis, monitoring key performance indicators (KPIs), and implementing sustainable solutions.
Maintain accurate maintenance records, troubleshooting documentation, and technical reports in accordance with company standards.
REQUIRED
Diploma or Advanced Diploma in Electrical & Electronic Engineering, Mechatronics Engineering, Mechanical Engineering, or equivalent technical discipline.
Minimum 3 to 5 years of hands-on experience in semiconductor equipment maintenance, troubleshooting, and sustaining support.
Strong experience in Die Prep equipment maintenance, including preventive maintenance (PM), corrective action (CA), machine conversion, and equipment qualification.
Proven ability to perform systematic troubleshooting, root cause analysis, and equipment performance optimization in a high-volume manufacturing environment.
Good understanding of semiconductor manufacturing processes, equipment reliability, and production support requirements.
PREFERRED
Extensive knowledge and hands-on experience in Backgrind, Wafer Saw, Wafer Mounting, Taping, and Die Prep processes.
Experience leading equipment improvement projects, machine upgrades, cost reduction initiatives, and productivity enhancement programs.
Familiarity with statistical and problem-solving tools such as 5 Why Analysis, Fishbone Diagram, FMEA, SPC, and CAPA.
Experience coordinating with Process, Manufacturing, Quality, and Engineering teams to drive yield improvement and resolve equipment-related issues.
Demonstrated ability to mentor and guide junior technicians while supporting technical skill development within the team.
SKILLS
Advanced troubleshooting and diagnostic skills for Die Prep equipment, including electrical, mechanical, pneumatic, servo, and automation systems.
Strong analytical and problem-solving skills with the ability to perform systematic root cause analysis and implement sustainable corrective actions.
Proficient in executing preventive maintenance, predictive maintenance, machine conversion, equipment qualification, and recovery from major breakdowns.
Ability to analyze equipment performance data, identify improvement opportunities, and drive continuous improvement projects.
Effective communication and teamwork skills with the ability to work independently and collaborate across multiple functional teams.
Strong sense of ownership, accountability, and commitment to equipment uptime, product quality, and manufacturing excellence.

Employment type
Full-time

Work arrangement
No