Live opening · Posted 5 days ago

Senior Wirebond Equipment Engineer

Texas Instruments · Melaka, Malaysia
Oracle
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At a glance

The key details from the original listing.

Posted 5 days ago
CompanyTexas Instruments
LocationMelaka, Malaysia
SourceOracle
Listed5 days ago

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About the role

Description supplied by the original job listing.

Change the world. Love your job.
Do you want to work for an organization that values your opinion? Do you want to work for an organization where you can play a pivotal role in several different areas? Look no further. As a Texas Instruments Wire Bond Equipment Engineer, you will have the opportunity to work in a vibrant and dynamic team oriented environment.
Responsibilities include:
Evaluating, selecting, and ordering equipment that is most appropriate and cost effective for the manufacture of company products
Overseeing the installation, modification, upgrade and maintenance of manufacturing equipment
Keeping current on equipment manufacturers' technical notices, upgrades and safety issues
Studying equipment performance and reliability
Establishing programs and solutions for increasing uptime and for equipment problems that affect the manufacturing process
Providing technical support to the manufacturing equipment repair and process engineering organizations
Defining and writing preventative maintenance schedules
Minimum Requirements:
Bachelor Degree of Electronics or Electrical engineering, Mechanical Engineering or related engineering degree
Minimum 5 years as Wirebond Equipment Engineer with KNS and ASM wirebond equipment maintenance experience in semiconductor manufacturing operations
Equipped with Wirebond process experiences will be added advantage
Work Arrangement: Full-time, onsite role based at Texas Instruments Malaysia, Batu Berendam, Malacca.
Preferred Qualifications:
Equipment experience with Wire bond process, must be able to hands on KNS and ASM wire bond machine
Prior experience with Gold/Cu/PCC wire & Bump ball process bonding
Equipment experience on other equipment post wire bond process (e.g., plasma, Die coat)
Experience on tool monitoring and interdiction software, and equipment maintenance and documentation
Working knowledge of semiconductor manufacturing, and SPC/Spotfire techniques. Experienced with semiconductor cleanroom protocol and behaviors.
Strong verbal and written communication skills
Demonstrated strong analytical, critical thinking and problem solving skills
Ability to work in teams and collaborate effectively with people in different functions
Ability to take the initiative and drive for results
Strong time management skills that enable on-time project delivery
Ability to work effectively in an interrupt-driven, fast-paced and rapidly changing environment
Demonstrated ability to build strong, influential relationships

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