Analog & Mixed-Signal (AMS) Circuit Designer

• Role Level: Core Engineering (Senior AMS Circuit Designer / Analog Lead)
• Location: Vijayawada (AP) / Hybrid (Flexible)
• Experience: 4+ years of dedicated hands-on experience in Transistor-Level Custom AMS Circuit Design with proven tape-out closure (or graduating M.Tech/Ph.D. with relevant silicon converter/front-end research)
APPLICANT SCOPE & SCREENING NOTICE (PLEASE READ CAREFULLY):
· Strictly Custom Silicon IC Design: This position requires transistor-level schematic design, device sizing, and SPICE simulation of custom analog blocks in Cadence Virtuoso / Spectre.
· Non-Applicable Profiles: Candidates whose experience is limited to standard cell library characterization (.lib modeling), automated digital RTL/FPGA implementation, or board-level (PCB) circuit design are not suitable for this silicon IC design role.
Role Overview:
Lead custom transistor-level schematic design, precision sizing, compact SPICE model verification, and AMS simulation of low-noise sensor front-ends, high-resolution column data converters, and precision power/bias management circuits on advanced deep-submicron CMOS and SOI process nodes. Working in close collaboration with our Silicon Architects and Custom Layout Engineers, you will own critical mixed-signal blocks from architectural definition through schematic sizing, Monte Carlo verification, and post-layout parasitic extraction (PEX) sign-off.
Key Responsibilities:
· Sensor Front-End Design: Architect, size, and simulate low-noise Capacitive Transimpedance Amplifiers (CTIA), Direct Injection (DI), Buffered Direct Injection (BDI), and Correlated Double Sampling (CDS) noise-filtering stages to achieve ultra-low input-referred noise and wide dynamic range.
· Column-Parallel Data Converters: Design high-resolution (12-bit to 14-bit), low-power column-parallel SAR ADCs operating within tight column-pitch constraints; implement asynchronous SAR timing control logic, monotonic/split-capacitor CDAC switching topologies, and dynamic comparators with Dynamic Offset Cancellation (DOC).
· Precision References & Power Management: Design curvature-compensated bandgap voltage references, low-noise bias current distribution networks, and high-PSRR on-chip Low Dropout (LDO) regulators with stable operation under wide capacitive loading.
· Extreme Temperature & PVT Verification: Perform rigorous multi-corner SPICE simulations across PVT corners (SS, FF, TT) and wide operational temperature envelopes, accounting for device threshold voltage shifts, carrier mobility variations, and leakage behavior.
· Statistical & Noise Modeling: Execute comprehensive Monte Carlo mismatch simulations, transient noise analyses, and Periodic Steady-State (PSS / Pnoise) regressions to ensure robust yield and offset cancellation.
· Layout Collaboration & Post-Layout Sign-Off: Collaborate directly with Custom Layout Engineers on schematic-driven layout (SDL), common-centroid matching, sensitive charge node shielding, and parasitic extraction (PEX) re-simulation to ensure zero post-layout performance degradation.
· Behavioral Modeling: Develop Verilog-A and SystemVerilog-AMS behavioral models for full-chip mixed-signal co-simulation and automated digital top-level verification.
Qualifications & Technical Skills:
· Education: M.Tech or Ph.D. in Microelectronics, VLSI Design, or Electrical Engineering with a focus on Analog & Mixed-Signal IC design.
· Experience: 4+ years of hands-on transistor-level custom analog circuit design experience with at least one successfully taped-out IC (commercial or multi-project wafer shuttle).
· Core Design Expertise: Proven track record in designing at least two of the following: SAR ADCs, CTIA / low-noise charge amplifiers, high-speed dynamic comparators, bandgap references, or on-chip LDO regulators.
· EDA Tools Mastery: Deep proficiency in Cadence Virtuoso Schematic Editor, Spectre / Spectre-AMS, ADE-XL/Assembler, and post-layout extraction flows (Quantus / Calibre PEX).
· Physics & Modeling Insight: Solid grasp of deep-submicron device physics, compact modeling (BSIM4, BSIM-IMG, PSP), noise mechanisms (1/f and thermal noise), and device mismatch mitigation.
· Professional Background: Prior experience at fabless semiconductor companies, analog IDMs, or specialized custom IC design houses is preferred.

Work arrangement
Hybrid