PCB Layout Designer

Company Description: Crystal Matrix Ltd obtained Govt. of India approval under the India Semiconductor Mission (ISM), Ministry of Electronics and Information Technology (MeitY), for setting up a state-of-the-art Compound Semiconductor Fab at Dholera Special Investment Region. The project will manufacture GaN epitaxy wafers and next-generation Mini/Micro-LED display panels, positioning India as a global player in advanced display and semiconductor technologies.
Role Description: This full-time, on-site PCB Layout Designer role is based in Hyderabad and involves end-to-end responsibility for printed circuit board layout design. The designer will translate schematics into optimized PCB layouts, select appropriate layer stack-ups, and ensure signal integrity, power integrity, and manufacturability. Daily tasks include collaborating with hardware and analog design engineers, performing design rule checks, preparing fabrication and assembly files, and updating layouts based on review feedback.
KEY RESPONSIBILITIES:
Design high-quality PCB layouts for multilayer boards based on schematics.
Collaborate with hardware, mechanical, and manufacturing teams throughout the product development cycle.
Create PCB layouts considering SI, PI, EMI/EMC, thermal management, and DFM/DFA.
Generate fabrication & assembly documentation including Gerber, IPC-2581, drill files, and BOM support.
Perform component placement, routing, DRC, and ECO implementation.
Support prototype bring-up, debugging, and production releases.
Coordinate with PCB fabricator and assembly vendors to resolve manufacturing issues.
Experience working with PCB fabrication and assembly vendors.
Knowledge of simulation tools and PLM/PDM systems is an added advantage.
Exposure to LED Display products is advantage.
REQUIRED SKILLS:
Proficiency in PCB CAD tools: Cadence Allegro (Preferred), Altium Designer, Mentor Xpedition / PADS.
Strong knowledge of: Multilayer PCB design (4–20+ layers); High-speed digital routing (FPGA, DDR, PCIe, USB, Ethernet, HDMI, etc.); Signal Integrity (SI) and Power Integrity (PI); EMI/EMC design practices; Controlled impedance routing & stack-up design; DFM, DFA & IPC standards (IPC-2221, IPC-7351B, IPC-A-600).
Experience with HDI, BGA fan-out, differential pair routing, length matching, and impedance-controlled designs.
Ability to interpret schematics and collaborate with hardware design engineers.
Strong analytical and problem-solving skills.
Good communication and teamwork.
Ability to manage multiple projects and meet deadlines.
Attention to detail and commitment to quality.
Qualification & Experience:
Bachelor’s degree or Diploma in Electronics Engineering or a related field.
5–10 years of hands-on experience in high-speed, multilayer PCB layout design
Interested can share cv on: hr@crystalmatirx.in or Whats app: 76739 52056
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Work arrangement
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