Director, Advanced Packaging Technology Development

Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
As a Director of Process Development in Advanced Packaging Technology Development (APTD) within Micron, you will provide strategic and technical leadership for the development and deployment of advanced packaging assembly processes enabling next-generation memory products. You will collaborate with internal and external stakeholders to define and execute technology development strategies aligned with organizational and business objectives. Your team will be responsible for developing scalable, manufacturable, and cost-effective assembly processes that deliver industry-leading performance, quality, yield, and reliability.
You will drive innovation across advanced packaging technologies including 2.5D, 3DIC, hybrid bonding, wafer-level and panel-level packaging, advanced interconnect solutions, and emerging assembly platforms. You will lead process development from concept through technology qualification, productization, and high-volume manufacturing transfer while ensuring alignment with Technology Development business processes.
In this role, you will develop organizational capability through leadership coaching, talent development, succession planning, and strategic workforce planning. You will establish performance metrics, drive continuous improvement initiatives, and provide organizational leadership in developing department strategies, technology roadmaps, and cross-functional execution plans.
Responsibilities include, but are not limited to, the following:
Technology Strategy and Roadmap Development
Develop and communicate advanced packaging process technology strategies aligned with Micron's long-term product and technology roadmap.
Define process development roadmaps for next-generation packaging platforms.
Evaluate emerging assembly technologies, materials, and equipment solutions to identify future competitive advantages.
Understand market, product, and technology trends and translate them into executable development strategies.
Influence organizational investment decisions through data-driven technical recommendations.
Process Technology Leadership
Establish strategic and long-term technical objectives for assembly process development organizations.
Drive innovation in die attach, hybrid bonding, thermocompression bonding, molding, underfill, substrate assembly, singulation, and related packaging processes.
Lead development of scalable manufacturing solutions for advanced packaging technologies.
Champion process architecture decisions balancing performance, manufacturability, cost, reliability, and cycle time.
Drive breakthrough solutions for challenging yield, reliability, and process integration problems.
Product Development and Manufacturing Readiness
Lead process development activities from concept through qualification and manufacturing transfer.
Ensure development projects meet technology milestones, quality expectations, and business objectives.
Drive manufacturability improvements through process optimization and design enablement.
Ensure process capability, yield targets, cost objectives, and reliability requirements are achieved.
Establish development methodologies, best practices, and qualification strategies.
Cross-Functional Leadership
Represent APTD Process Development in company-wide technical and business initiatives.
Partner with Process Integration, Design, Product Engineering, Reliability, Manufacturing, Procurement, Quality, and Supply Chain organizations.
Develop strategic partnerships with equipment and material suppliers.
Lead cross-functional teams in resolving complex technical and operational challenges.
Influence internal and external stakeholders without direct authority.
Organizational Leadership
Build and develop a high-performing technical organization.
Create a culture focused on innovation, collaboration, accountability, and continuous improvement.
Establish succession plans and organizational capability roadmaps.
Mentor managers, technical leaders, and emerging talent.
Drive employee engagement, inclusion, and leadership development initiatives.
Business Impact and Execution
Ensure critical deliverables, milestones, and business objectives are achieved.
Guide effective utilization of personnel, capital, and equipment resources.
Drive productivity improvements, cycle-time reduction, and cost optimization initiatives.
Make decisions that directly impact product competitiveness and organizational success.
Monitor and communicate key performance indicators to senior leadership.
Continuous Improvement and Growth
Apply Artificial Intelligence to promote adoption of new technologies, data science methodologies, and advanced analytics.
Foster a growth mindset within the organization.
Drive continuous improvement in process development methodologies and execution efficiency.
Encourage cross-functional learning and knowledge sharing.
Qualifications and Skills
Experience
Minimum 12 years of semiconductor industry experience with at least 5 years in advanced packaging technology development.
Minimum 5 years of leadership experience managing managers and/or large technical organizations.
Demonstrated success developing and qualifying advanced packaging technologies from concept to manufacturing.
Experience working with global teams and external technology partners.
Technical Expertise
Strong knowledge in one or more of the following areas: 2.5D and 3D packaging technologies; hybrid bonding