Sr. Packaging Engineer (Semiconductor)

Responsibilities
Develop new packages and processes to support new product launches on time. (50%)
Carry out Packaging Design for new products, feasibility studies with Assembly subcons, Risk Assessments and develop Gantt charts for projects. (30%)
Troubleshoot and Support production related packaging issues. (20%)
Designing new packages, layout of lead frame and substrate panels.
Run risk analyses for new product scenarios.
Debug subcon production issues.
Make design and process decisions to achieve best in class new product realization.
Minimum Qualifications
B.Sc. ENG. Preferably Masters with major in Materials Science or Electrical Engineering
8 to 10 years of experience working in packaging industry either for assembly subcon or as a designer in New Product Team
Excellent analytical and trouble shooting skills with the ability to proactively solve issues
Effective verbal and written communication to interface at all levels within the organization
Strong sense of urgency to meet product requirements on schedule
Experience in working with international and cross-functional teams
AutoCAD package design is required. SolidWorks and Thermal simulations are plus.
Proficiency in Microsoft Office™ products - Excel, Word, Visio, Power Point, Project

Work arrangement
No