Live opening · Posted 3 days ago
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Description
The Amazon Devices team designs and engineers high-profile consumer electronics, including the best-selling Kindle family of products. We have also produced ground breaking devices like Fire tablets, Fire TV, Amazon Dash, and Amazon Echo. What will you help us create?
As a Platform BSP Engineer you will help build the kernel stack and BSP for various SoCs with custom hardware accelerators to be deployed in a range of Amazon devices. You will develop software for industry standard and custom hardware IP to accelerate applications in machine learning, computer vision and robotics.
In This Role You Will
Developing/modifying BSP: this can include bootloaders (ATF or OPTEE or u-boot), device drivers, kernel and device tree support
Performing initial hardware bring-up and system integration
Maintaining/updating the embedded Linux Yocto distribution
Maintaining a continuous integration environment, including packaging and deployment of software releases
USB driver experience
Basic Qualifications
Bachelor's degree or equivalent
3+ years of non-internship professional software development experience
Experience in embedded development in C/C++
Hands-on experience in any of boot-loaders (ATF or OPTEE or u-boot)
Hand-on experience in Linux kernel internal
Proven experience in the Device controller or host client drivers
Preferred Qualifications
Development experience in Silicon Software
HSIO devices (USB or eMMC or PCIE ) and LSIO devices (I2C, SPI, DMA, PWM etc.) driver experience
Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit https://amazon.jobs/content/en/how-we-hire/accommodations for more information. If the country/region you’re applying in isn’t listed, please contact your Recruiting Partner.
Company - ADCI - BLR 14 SEZ
Job ID: A10574424
Work arrangement
No
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