Live opening · Posted 8 hours ago

Software Engineering - BSP Kernel

Harman International Romania SRL · Bangalore - Karnataka, India - Kalyani Platina
Workday
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At a glance

The key details from the original listing.

Posted 8 hours ago
CompanyHarman International Romania SRL
LocationBangalore - Karnataka, India - Kalyani Platina
SourceWorkday
ListedPosted 8 hours ago

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About the role

Description supplied by the original job listing.

HARMAN’s engineers and designers are creative, purposeful and agile. As part of this team, you’ll combine your technical expertise with innovative ideas to help drive cutting-edge solutions in the car, enterprise and connected ecosystem. Every day, you will push the boundaries of creative design, and HARMAN is committed to providing you with the opportunities, innovative technologies and resources to build a successful career.
A Career at HARMAN
As a technology leader that is rapidly on the move, HARMAN is filled with people who are focused on making life better. Innovation, inclusivity and teamwork are a part of our DNA. When you add that to the challenges we take on and solve together, you’ll discover that at HARMAN you can grow, make a difference and be proud of the work you do everyday.
About the Role
you will be involved in kernel development, device driver integration, board bring-up, system debugging, performance optimization, and hardware-software integration activities. You will play a key role in delivering robust, scalable, and production-quality embedded Linux solutions for global automotive customers.
Your Team
You will be part of a highly skilled Linux Platform and BSP engineering team responsible for developing Automotive Infotainment platforms across multiple customer programs. You will collaborate closely with BSP architects, kernel developers, device driver engineers, integration teams, validation teams, hardware teams, and SoC vendors
What You Will Do
Linux Kernel & BSP Development
• Develop, customize, maintain, and debug Linux Kernel and BSP software for Automotive IVI platforms.
• Develop, integrate, and maintain platform-specific software components.
• Support kernel upgrades, feature enablement, and platform migrations.
• Participate in architecture discussions and contribute to platform design reviews.
Design, develop, integrate, and debug Linux device drivers. Support driver development for subsystems like Display, Audio, USB, Storage ,Connectivity modules, Sensors, Vehicle interfaces etc
• Work closely with hardware teams to enable and validate new peripherals and platform features.
• Work with automotive and embedded SoCs including Qualcomm, Samsung Exynos, MediaTek, NXP, Renesas, and TI platforms.
• Perform root-cause analysis and resolution of Linux Kernel, BSP, and system-level issues, including kernel crashes, panics, memory leaks, driver defects, boot-time/runtime failures, and stability problems by analyzing kernel logs, crash dumps, trace data, and open-source software components.
• Drive system performance analysis and optimization by identifying and resolving bottlenecks related to CPU utilization, memory consumption, boot time, responsiveness, stability, reliability, and overall platform performance.
What You Need
• Bachelor’s or master’s degree in computer science, Electronics Engineering, Embedded Systems, or a related technical discipline.
• 3-5 years of hands-on experience in Linux Kernel, BSP, and Embedded Software Development, preferably in Automotive IVI or embedded platforms.
• Strong expertise in Linux Kernel internals, device driver development, BSP customization, board bring-up, hardware-software integration, and Embedded Linux architecture.
• Proficient in Embedded C programming with knowledge of C++, and hands-on experience with Device Tree, bootloader concepts, and ARM-based architectures.
• Good understanding of Linux Kernel subsystems, including Memory Management, Interrupt Handling, IPC, Filesystems, and Power Management, along with strong debugging and root-cause analysis skills.
• Experience with debugging and profiling tools (GDB, ftrace, perf, strace, crash), Git-based development workflows, CI/CD environments, and communication interfaces such as SPI, I2C, UART, and I2S etc
What is Nice to Have
• Experience with Qualcomm Snapdragon Automotive platforms.
• Experience with MediaTek, Samsung, NXP, and TI automotive SoCs.
• Experience in Automotive Infotainment (IVI), Cockpit, or Digital Cockpit platforms.
• Knowledge of automotive communication protocols and vehicle interfaces.
• Experience with performance profiling, tracing, and system optimization tools.
• Exposure to Hypervisor and Multi-OS environments.
• Familiarity with Automotive Cybersecurity concepts.
• Familiarity with Functional Safety (FuSa) concepts.
• Experience working in ASPICE-compliant development environments.
What Makes You Eligible
• Ability to lead teams and customer engagements.
• Willingness to travel as required.
• Passion for technical excellence and mentoring.
• Contribute to continuous improvement of HARMAN’s architecture design processes
What We Offer
• Hybrid work environment
• Extensive training opportunities through our own HARMAN University
• Competitive wellness benefits
• An inclusive and diverse work environment that fosters and encourages professional and personal development
• Work in a diversified cross culture project team with the biggest worldwide automotive OEM customers
HARMAN is proud to be an Equal Opportunity / Affirmative Action employer. All qualified applicants will receive consideration for employment without regard to race, religion, color, national origin, gender (including pregnancy, childbirth, or related medical conditions), sexual orientation, gender identity, gender expression, age, status as a protected veteran, status as an individual with a disability, or other applicable legally protected characteristics.

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