Hardware Engineer – PCB / IC Package Layout

Shape next-generation semiconductor test platforms at SAS Advanced Technologies. Take ownership of PCB and/or IC package layout—from placement and high-speed routing to manufacturing release—working closely with hardware engineers, SI/PI specialists, and customers.
What you’ll do:
• Execute multilayer placement and routing, including high-speed and power nets.
• Implement stack-ups, impedance control, length matching, and SI/PI recommendations.
• Complete DRC/DFM checks and prepare manufacturing deliverables.
• Collaborate with customers, hardware engineers, and SI/PI specialists.
What you’ll bring:
• Bachelor’s or Master’s degree in Electronics/Electrical Engineering or a related field.
• Minimum 5 years of hands-on PCB and/or IC package layout experience.
• Proficiency in Allegro, Altium, Xpedition, or Cadence APD.
• Strong knowledge of multilayer stack-ups, BGA breakouts, and high-speed routing.
Advantage: Experience with HDI, advanced packaging, SerDes/DDR/PCIe, or semiconductor test hardware.

Work arrangement
No