Live opening · Posted 21 hours ago

Internship for 2027: Innovative Medical healthcare solutions for the wellbeing and advanced wearable applications

Texas Instruments · Issy-Les-Moulineaux, Hauts-de-Seine, France
Oracle
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At a glance

The key details from the original listing.

Posted 21 hours ago
CompanyTexas Instruments
LocationIssy-Les-Moulineaux, Hauts-de-Seine, France
SourceOracle
ListedPosted 21 hours ago

About the role

Description supplied by the original job listing.

Internship subject:
Our analog front ends (AFEs) for biosensing applications are designed to meet the exacting standards for clinical applications, while bringing an unmatched combination of high performance, low power and small form factor critical for wearables. These AFEs range from standalone signal chains for PPG applications like heart rate monitoring and SpO2, to signal chains that enable the simultaneous acquisition of PPG, ECG and bio-impedance signals. All these AFEs are designed to solve signal conditioning challenges in wearable devices with small form-factor sensors, while allowing for scalability and maximum flexibility for the product designer to come up with an optimized sensor and industrial design that best suits their needs.
Your goal during this internship will be to address this challenge with the use of Texas Instruments (TI) devices in the signal chain, as well as processing and power conversion area. You will achieve this by prototyping, testing, and comparing newest TI solutions with what currently exists on the market. Exchange with industry experts and report your findings both internally and to customers.
The internship mission revolves around 3 guiding steps: the rest of the project will be defined together with the intern:
Build your own understanding of the customer & Medical Healthcare market needs
Evaluate new semiconductor technologies that TI can propose for the key function of this ecosystem, and compare it versus what our competition is currently proposing from a technical & price perspective
Ideally design and assemble at least one PCB to showcase customers the technical advantages of TI solution
You will lead the project definition and the level of difficulty as well as what you want to spend time on, from using premade building blocks to designing them, from focusing mostly on algorithms, software or hardware with the guiding hand of local Application Engineers and TI System Experts.
In the end, you will showcase it to our customers in order to highlight TI technological differentiation and what it can bring to our customers.
Profile:
Enrolled in Electrical engineering
Strong analytical and problem-solving skills
Ability to work independently as a team member
Strong communication & ability to present
Strong technical skills
Hands-on experience with lab equipment (oscilloscopes, multimeters, active loads, waveform generators, etc…)
Experience with schematic design and layout is preferred
Minimum B2 in English
Other information specific to the role (i.e. % travel...)
Support the Field Sales and Field Application Engineer to visit customers and solve their design challenges
If successful during your internship it may lead to you being hired as a graduate Analog Field Application Engineer or Technical Sales Representative in 2027.

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