Public listing

Group Leader – End of Line (Ball, Lid, Saw & Pack)

Flexiple Bhubaneswar, Odisha, India (On-site)
  • Experience10+ yrs
  • Work modeNo
  • ListedPosted 1 day ago
  • SourceLinkedin

Role overview

About the role

Description supplied by the original job listing.

Hiring for 3D Glass Solutions, Inc. — via Flexiple, the recruiting partner on this role.
About Company
3D Glass Solutions (3DGS) is a US advanced-packaging company using its patented photo-definable APEX® glass technology for RF, photonics, IC and system-in-package devices. Through its Indian entity, 3DGS is building a vertically integrated glass-core substrate and chip assembly plant in Bhubaneswar, Odisha, approved under the India Semiconductor Mission. The assembly team is small today, and the people who join now will select tools, qualify the line and build the teams that run it.
Job Roles & Responsibilities
Lead development, optimization and qualification of ball attach (strip and singulated), reflow, cleaning, TIM and lid attach, strip saw singulation, laser marking, AVI/X-ray inspection and bake and dry pack for FCBGA, fcCSP and wbCSP products
Own combined process and equipment ownership for the module: process windows, tool qualification (SAT, IQ/OQ/PQ), equipment capability and module yield
Own the end-of-line quality gate: lot acceptance, sampling plans, MSL classification, dry pack, packing/labeling controls and outgoing quality data
Lead root cause analysis for defects such as missing/double balls, ball voids, coplanarity excursions, TIM voids, lid tilt, chipping, burrs and delamination
Establish AVI and X-ray inspection strategy, recipes, accept criteria and escape/false-call monitoring
Qualify solder balls, fluxes, TIMs, lid adhesives, blades and jigs with suppliers
Build, train and certify the end-of-line team of engineers and technicians
Drive PM optimization, spares strategy and troubleshooting on ball attach, lid attach, saws, laser markers, inspection and dry pack equipment
Ideal Candidate Profile
10+ years hands-on in ball attach, lid attach, singulation, inspection and packing at an OSAT, ATMP or IDM assembly site, owning multiple tool types
Engineering degree in Mechanical, Materials, Electrical, Chemical, Industrial or a related field
Part of at least one new line installation, qualification or capacity ramp
Has trained and certified entry-level engineers and technicians in a multi-tool production environment
Experience with SPC, DOE, FMEA, process characterization, yield analysis and structured troubleshooting
Prior leadership of engineers, technicians and cross-functional teams in a production or ramp environment
Willing to relocate to Bhubaneswar, Odisha
Strong grasp of solder ball metallurgy, coplanarity, TIM/lid adhesive behavior and J-STD-020 MSL/dry pack requirements
Experience with strip and singulated flows, large-body lidded FCBGA and outgoing quality gate ownership is highly preferred
Originally posted on: 30 Sept 2026

Experience
10+ yrs

Work arrangement
No

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