Technology Development Process Integrator Engineer

onsemi is seeking a highly motivated engineer to work in our Technology Development group as a Process Integrator on Image Sensor technologies. This will include driving continuous improvement on new processes, new pixel architecture and technologies, Yield and Performance improvements, and New Product/Technology Introduction and ramp to volume manufacturing.
Required Qualifications:
Education: BS in Engineering or Materials Science
Experience: 2-4+ years of relevant experience in semiconductor manufacturing integration and technology development.
Familiar with 5S, 8D, 6-sigma, SPC, DOE, FMEA
Language Fluency – Fluent in English Language, written & verbal
Salary: onsemi is excited to share the base salary range for this position is $102,600 to $179,600 exclusive of fringe benefits or potential bonuses. The final pay rate for the successful candidate will depend on geographic location, skills, education, experience, and/or consideration of internal equity of our current team members. We also offer a competitive benefits package. https://www.onsemi.com/site/pdf/Benefits-Summary-USA.pdf
Essential Responsibilities:
Support new product development from the development phase through manufacturing, including full documentation to support ONSEMI’s process change review.
Ability to work well within a global, matrixed team and drive projects and results independently.
Ability to communicate effectively with all levels of the organization, including executive staff.
Ability to operate independently and translate high-level objectives into detailed execution plans.
A team player with strong listening skills who can take input and make informed decisions.
Demonstrated understanding of Semiconductor technology, manufacturing, new product development, device, and Yield improvement.
Ability to use Probe, In-line test, and Failure analysis data to champion and follow through with process changes.
Proven experience and deep knowledge of Image Sensor technology, as well as Pixel architecture and device performance, are highly preferred.
Broad, cross-functional experience in semiconductor development and manufacturing is preferred, with specialization in Image Sensors highly desirable.
Specific skills in BEOL Cu integration, Hybrid Bonding, optical film stack deposition, and Back-Side Illumination integration.
Proficiency in SW tools such as MS Excel, PowerPoint, Word, MS Project, and Yield analysis tools such as Shiny, Excensio, JMP, etc.
Drove cost reduction through yield enhancement and process simplification

Skills
Excel, Documentation