Live opening · Posted 11 days ago
NXP Semiconductors · Kuala Lumpur
Workday
You are 11 days behind. JobBeeper subscribers saw this role while it was still new.
At a glance
The key details from the original listing.
CompanyNXP Semiconductors
LocationKuala Lumpur
SourceWorkday
Listed11 days ago
Your early-applicant advantage
Live timing from JobBeeper.
0 min
from Workday publishing this role to us finding it
5 min
median time from a role going live to a subscriber being told
6 hours
subscribers had this role before this page existed
15,869
roles found in the last 24 hours — the newest are not on this site yet
About the role
Description supplied by the original job listing.
Key Responsibilities:
1.Perform wire bond process task on quality hold material
2.Collaborate with engineering to improve WB processes and techniques.
3.Assist in resolving WB-related issues to minimize production downtime.
Requirements:
1.Diploma or above in Engineering or a related field.
2.Working experience with WB process is preferable and recommended
3.Strong attention to detail and technical troubleshooting skills.
#LI-DNI
More openings worth a look
Recently tracked roles with full details and direct application links.
Good roles move before most people even see them.
Tell JobBeeper what you want and get fresh matches delivered in minutes.
Start your free trial →