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Company Description Mirafra Technologies is a leading provider of turnkey ASIC solutions and semiconductor engineering services, supporting global technology companies from concept to silicon to system. With a team of more than 2,200 engineers and delivery centers across India, the United States, Germany, Taiwan, and Malaysia, Mirafra offers strong domain expertise and a scalable global delivery model. The company covers the full semiconductor lifecycle, including architecture, design, verification, physical implementation, embedded software, and system solutions. Mirafra’s track record includes over 650 tape-out contributions and partnerships with more than 50 semiconductor customers, from startups to major industry leaders. In addition, Mirafra enables intelligent embedded products and digital transformation through AI, cloud, data engineering, and software solutions, helping customers reduce complexity and accelerate time-to-market.
Role Description This is a full-time, on-site role based in Bengaluru South for an i2S/TDM engineer with strong C programming skills and experience in Linux and DSP environments. The role involves designing, developing, and optimizing low-level software components and drivers related to i2S/TDM interfaces on embedded platforms. Responsibilities include implementing and debugging C code, integrating DSP algorithms, and working closely with hardware and firmware teams to validate and optimize system performance. The engineer will analyze issues at the interface and OS level, perform root-cause analysis, and provide robust fixes and enhancements. The role also includes collaborating with cross-functional teams, preparing technical documentation, and participating in code reviews and continuous improvement activities.
Qualifications
Strong proficiency in C programming for embedded systems, including debugging, optimization, and memory management.
Hands-on experience with Linux platform development, kernel/user space programming, and driver-level integration.
Practical experience with DSP-based systems, including integration of signal processing algorithms and performance tuning.
Working knowledge of audio and communication interfaces such as i2S and TDM, including configuration, testing, and validation.
Understanding of embedded architectures, real-time constraints, and hardware–software interaction.
Ability to use embedded development tools (compilers, debuggers, oscilloscopes, logic analyzers, protocol analyzers) effectively.
Strong problem-solving skills, attention to detail, and ability to work independently in a fast-paced engineering environment.
Excellent written and verbal communication skills for collaboration with cross-functional and global teams.
Bachelor’s or Master’s degree in Electronics, Computer Science, Electrical Engineering, or a related technical discipline.
5+ years of relevant experience in embedded software development, preferably in semiconductor or telecom/embedded product domains.
Work arrangement
No
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