Live opening · Posted 9 days ago

Chip Level Service Technician - BGA Repair

SensiGo Technologies · Chennai | Cuddalore
Instahyre 2-6 yrs
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At a glance

The key details from the original listing.

Posted 9 days ago
CompanySensiGo Technologies
LocationChennai | Cuddalore
Experience2-6 yrs
SourceInstahyre
Listed9 days ago

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About the role

Description supplied by the original job listing.

SensiGo Technologies is looking for a skilled BGA Repair Engineer to join our SMT/PCB repair and rework team. This role covers complex, escalated motherboard and component-level repair work, from BGA rework and reballing to advanced micro-soldering and full diagnostic troubleshooting on laptop and PCB motherboards.
Responsibilities:
Execute BGA removal, replacement, reballing, and rework on motherboards and PCBs.
Handle complex and escalated motherboard/component-level repairs, including no-power and boot-failure diagnosis.
Perform advanced micro-soldering and component-level repairs.
Operate BGA rework stations and hot-air rework equipment.
Diagnose defects, including open/short connections, solder bridging, and cold joints.
Perform microscopic inspection and accurate BGA reballing using stencils and flux.
Conduct power-sequence troubleshooting and root cause analysis of failures.
Analyze schematics and board-view diagrams to trace and resolve faults.
Troubleshoot BIOS/EC/KBC-level issues.
Maintain repair records and ensure compliance with ESD safety protocols.
Mentor junior technicians and support process improvement initiatives
Requirements:
Strong hands-on experience in BGA repair, reballing, and rework.
Expert-level motherboard/component-level repair capabilities.
Micro-soldering and BGA/rework expertise.
Advanced schematic and board-view analysis.
Experience in power-sequence analysis and circuit-level diagnostics, BIOS/EC/KBC troubleshooting.
Knowledge of SMT components and PCB assembly processes.
Proficiency in reading PCB layouts, circuit diagrams, BOMs, and component references.
Advanced multimeter, DC power supply, and oscilloscope proficiency.
Microscope handling and inspection skills.
ESD-safe handling practices.
Strong electronic troubleshooting and analytical ability.
Chip-level servicing experience gained at authorized or independent service centers.
Prior experience in laptop/motherboard or PCB repair and rework preferred.
Technical courses/training attended in chip-level repair, BGA rework, or laptop motherboard servicing.

Experience
2-6 yrs

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