Technical Module Owner (f/m/x)

ZEISS Semiconductor Manufacturing Technology​
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Enabler for smaller, more powerful, and more energy-efficient microchips​
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Working for tomorrow today. ​
Around 80 percent of all microchips worldwide are produced using ZEISS technologies. As the centerpiece of every electronically controlled system, they have become an integral part of our everyday lives – whether in smartphones, smart homes or smart factories. ZEISS is a technology leader in the field of semiconductor manufacturing equipment. With high-precision lithography optics, photomask systems and process control solutions, ZEISS enables the production of ever smaller, increasingly powerful, and more energy-efficient microchips, and thus plays a pivotal role in the age of micro- and nanoelectronics.
Your role
take module ownership for camera components within a high-precision machine for mask metrology
coordinate interdisciplinary development activities across camera hardware, electronics, firmware & software, metrology algorithms, controls and system integration
starting from module requirements and interfaces, define design, verification plans and acceptance criteria for camera functionalities and information to be processed and sent to other modules
plan and steer technical work packages, milestones, risks, dependencies, design reviews, integration steps and documentation deliverables for the assigned modules
ensure technical consistency between camera acquisition, calibration, data handling, metrology processing and machine-level performance budgets
drive integration, commissioning and issue resolution together with internal experts, suppliers and project stakeholders, ensuring transparent status, priorities and decisions
Your profile
a university degree in electrical engineering, mechatronics, computer science, physics or a comparable technical field
technical understanding of camera-based inspection systems, image acquisition chains, calibration concepts, metrology and high-precision machine integration
experience in coordinating complex module development across hardware, software, algorithms, electronics and metrology disciplines
good knowledge of requirements engineering, interface management, verification planning, error budgeting, technical risk management and structured decision preparation
strong project coordination skills, including milestone planning, dependency tracking, stakeholder alignment, backlog prioritization and escalation of technical impediments
experience working with suppliers and internal development partners on camera hardware, test setups, prototype builds, data flows, commissioning and troubleshooting
very good communication skills in English and German
Your ZEISS Recruiting Team:
Janina Kalmbach