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Role 3: Firmware Engineer
Location: Bangalore
Exp: 1 to 3 Years
Skills: Firmware, Embedded C, C++, OpenBMC, OBMF-ICP, PLDM
Job Description
Areas of Responsibility:
OBMF-ICP Protocol Stack: Design, implement, and maintain the OBMF-ICP protocol stack and core protocol components.
Transport Bindings: Develop and integrate OBMF-ICP transport bindings over USB and MCTP.
Hardware Bring-up: Lead end-to-end hardware bring-up, including board validation, interface debugging, and firmware readiness.
OCP Collaboration: Represent the program in OCP working-group discussions, reviews, and technical alignment activities.
Technical Leadership: Drive architecture, resolve cross-layer issues, and establish implementation and validation best practices.
Key Skills: OCP DC-SCM/DC-MHS, USB
Experience
1 - 3 years of experience
Expert embedded C, strong C++
BMC / platform-management firmware experience (OpenBMC strongly preferred)
DMTF MCTP and PLDM (incl. PLDM firmware update); working knowledge of SPDM
Hands-on USB, I2C/SMBus, I3C, SPI, UART, GPIO; logic/protocol analyzers, JTAG/SWD
RTOS (Zephyr/FreeRTOS) and/or embedded Linux on Arm Cortex-M / RISC-V
Yocto/BitBake, CMake/Meson, Git, CI
Understanding of I2C/SMBus, SPI, UART, USB, GPIO
Basic hands-on with logic analyzers, oscilloscopes, JTAG/SWD; can read datasheets and schematics
Work arrangement
No
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