Live opening · Posted 16 hours ago

Semi Mfg Technician 2 (DFAB - S4)

Nokia · United States
Oracle No
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At a glance

The key details from the original listing.

Posted 16 hours ago
CompanyNokia
LocationUnited States
Work modeNo
SourceOracle
Listed16 hours ago

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About the role

Description supplied by the original job listing.

As a Die Fab Operator at Nokia, you will play a pivotal role in our cutting-edge cleanroom team, focused on processing optoelectronic devices. You'll work closely with engineers and management to ensure the quality and efficiency of semiconductor wafers and Photonic Integrated Circuits (PICs). Your day-to-day responsibilities will involve meticulous inspection of materials, precision cleaving of wafers, and operating advanced evaporation tools to apply antireflective coatings. In our dynamic, collaborative environment, you'll contribute to groundbreaking technology while adhering to strict safety and cleanliness protocols. With each task, you'll have the opportunity to make an immediate impact on product quality and innovation. The culture values proactive communication, allowing you to share insights and unexpected findings with your team. You'll be integral to our mission of delivering high-quality optoelectronic solutions that shape the future of connectivity.
This position is for shift 5 - 6:00 PM to 6:00 AM, Monday - Wednesday and every other Thursday.
You have:
High school diploma or GED
Ability to work effectively in a cleanroom environment
Strong attention to detail for inspecting semiconductor wafers and PICs
Basic computer skills for data entry and communication
It would be nice if you also had:
Experience with optical inspection tools and techniques
Familiarity with semiconductor fabrication processes
Technical training or coursework in electronics or engineering
Strong problem-solving skills and ability to communicate unexpected results
Process optoelectronic devices in a cleanroom environment, ensuring high-quality output.
Inspect semiconductor wafers and Photonic Integrated Circuits (PICs) for any defects using advanced microscopy techniques.
Cleave wafers into PICs with precision tools, maintaining high accuracy and attention to detail.
Operate evaporation equipment to apply antireflective thin film coatings on PICs.
Record and analyze measurement data accurately in a computer database.
Communicate any anomalies or unexpected results promptly to management and engineering teams.
Uphold strict adherence to safety and cleanliness standards within the Fab environment.
Support effective shift transitions by accurately conveying tool and lot statuses to the next team.

Work arrangement
No

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