TPM (Advanced SoC Physical Design)

Job Title – TPM (Advanced SoC Physical Design)
Job Location – 100% Remote
Job Duration- 1+ year
Role Summary
· The Technical Program Manager (TPM) – Advanced SoC Physical Design is responsible for leading end-to-end execution of complex SoC implementation programs from RTL handoff through GDSII signoff.
· The role combines deep technical expertise in advanced-node Physical Design with strong program leadership, customer engagement, risk management, and cross-functional coordination across Design, Verification, DFT, Package, CAD, and Silicon Validation teams.
· The TPM serves as the single point of accountability for delivery predictability, schedule adherence, quality, customer communication, and successful tape-out execution.
· The ideal candidate possesses strong full-chip implementation experience across advanced process technologies and has demonstrated success driving large-scale ASIC/SoC programs to production.
Required
· B.E./B.Tech/M.E./M.Tech in Electronics, Electrical Engineering, Computer Engineering, or related field.
· 12–18+ years of semiconductor industry experience.
· Minimum 5+ years leading SoC implementation programs or full-chip tape-outs.
· Proven experience managing customer-facing engagements and large delivery teams.
· Track record of successful silicon tape-outs at advanced process nodes.
Preferred
· Experience managing multi-site/global development teams.
· Exposure to HPC, AI/ML, Data Center, Networking, Mobile, or Automotive SoCs.
· PMP, PgMP, Agile, or equivalent program management certification.
· Experience with AI-assisted design methodologies and EDA automation.

Work arrangement
Yes