Director, Advanced Power Silicon & Packaging Technology

Position Summary
The Director of Advanced Power Silicon & Packaging Technology leads the strategy, architecture, development, and deployment of next-generation power delivery technologies spanning silicon, package, and system integration. This role is responsible for driving innovation in power semiconductors, advanced packaging, and silicon-package-system co-optimization for AI, datacenter, networking, and high-performance computing platforms.
The director partners across silicon design, packaging, architecture, manufacturing, and product organizations to deliver breakthrough improvements in power efficiency, power density, performance, reliability, and total cost of ownership.
Key ResponsibilitiesTechnology Strategy & Vision
Define and execute the long-term roadmap for:
Advanced power silicon technologies
Advanced packaging and heterogeneous integration
Chip-package-system co-design
Vertical power delivery solutions
Identify disruptive technologies and assess strategic investment opportunities.
Drive technology differentiation and competitive advantage.
Power Silicon Leadership
Drive adoption of advanced semiconductor technologies including:
GaN power devices
SiC technologies
Advanced CMOS and BCD power processes
Optimize power efficiency, die area, and reliability.
Advanced Packaging Leadership
Establish packaging technology roadmaps for:
2.5D and 3D packaging
Chiplet architectures
Silicon interposers
Fan-out packaging
Embedded power delivery
Co-packaged solutions
Lead package electrical, thermal, and mechanical optimization.
Drive package innovations enabling higher power density and lower power delivery losses.
Silicon-Package-System Co-Design
Lead cross-functional initiatives to optimize:
Power integrity (PI)
Signal integrity (SI)
Thermal performance
Electromigration reliability
Power delivery network (PDN)
Develop end-to-end power architectures from regulator to transistor.
Research & Innovation
Lead advanced technology incubation and proof-of-concept programs.
Build strategic partnerships with:
Semiconductor foundries
OSAT partners
EDA vendors
Universities and research institutions
Create and manage intellectual property portfolios.
Drive patent generation and technical publications.
Organizational Leadership
Establish a culture of technical rigor, innovation, accountability, and execution excellence.
Mentor senior technical leaders and develop organizational capability.
Required QualificationsEducation
BS in Electrical Engineering, Physics, Materials Science, or related discipline.
MS or PhD preferred.
Experience
15+ years of semiconductor and power technology experience.
6+ years leading technology, architecture, or engineering organizations.
Proven success delivering innovative silicon and packaging technologies from concept through production.
Technical ExpertisePower Silicon
Power semiconductor devices
Power integrity analysis
Advanced Packaging
Chiplet integration
2.5D/3D packaging
Fan-out technologies
Silicon interposers
Package reliability and qualification
Systems Knowledge
Power delivery networks
Thermal management
Manufacturing and supply chain considerations
Preferred Qualifications
Expertise in:
Vertical power delivery
Backside power distribution networks
Embedded voltage regulation
Strong patent portfolio and industry recognition.
Participation in IEEE, OCP, JEDEC, or semiconductor standards organizations.
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