Live opening · Posted 1 day ago

Senior Wirebond Process Engineer

Texas Instruments · Melaka, Malaysia
Oracle
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At a glance

The key details from the original listing.

Posted 1 day ago
CompanyTexas Instruments
LocationMelaka, Malaysia
SourceOracle
ListedPosted 1 day ago

About the role

Description supplied by the original job listing.

Change the world. Love your job.
Texas Instruments is looking for an energetic engineer with a passion for process. This position provides the opportunity to drive continual improvement at all levels. Our team is primarily focused on driving improved procedures and processes. We are searching for a self-directed, highly motivated engineer to join our team.
The responsibilities of a Manufacturing Process Engineer in this role include:
Develop and implement improved methods of manufacturing, procedures, and processes that result in improved efficiencies, yields, machine operations, and quality
Support wirebond processes for customer deliverable materials
Document wirebond process details in specifications and work instructions
Define applicable wirebond materials for specific applications (wire type, capillary part numbers, etc)
Define statistical monitoring methods supporting developed wire bond processes
Implement project or improvement plans for areas of responsibility including but not limited to: efficiency improvements, cost reduction or quality improvement programs, new product support and other process improvements
Perform lot and equipment dispositions to support the continuous flow of production and to minimize cycle time in a high volume manufacturing 300mm wafer Fab running Analog Technologies
Identify systematic problems in either process or equipment related sources and communicating findings to the engineering staff in a continuous manner
Support the manufacturing ramp with execution of equipment/process startup, process experiments (SWRs)
Participate in data analysis and problem resolution
Minimum requirements:
Bachelor's degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Physics, or a related field
Cumulative > 3.3 CGPA and above
Experience in KNS and ASM wirebond machine in semiconductor manufacturing operations
Experience in wedge bonder wirebond machine will be added advantage
Strong foundation in statistical process control, engineering change control and process release strategies
Preferred qualifications:
Demonstrated strong analytical and problem solving skills
Strong verbal and written communication skills
Ability to work in teams and collaborate effectively with people in different functions
Strong time management skills that enable on-time project delivery
Demonstrated ability to build strong, influential relationships
Ability to work effectively in a fast-paced and rapidly changing environment
Ability to take the initiative and drive for result

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