Engineer II Device

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Job Description:
STEP R&D Department Description
The STEP (Strategic Technical Enablement Partnership) and R&D department is part of Microchip’s global front-end of line wafer fabrication organization. The team is in charge of technology transfers, technology enhancements, and process and device development projects running in internal and foundry wafer FAB’s.
Our team work across multiple locations, providing multi geographical R&D and technology support to the different business units.
Device Engineer description & objectives
Reporting to a STEP and R&D manager in Rousset you will collaborate with team members in France and in the United States (Reading, Tempe & San Jose).
As a device engineer, you will contribute to technology transfer, enhancement, and development projects, focusing on BCD MOS technologies.
Your responsibilities will include:
· Work with Design, Fab and Product Engineering teams to drive yield improvement, and circuit optimization, and device performance enhancement, especially on BCD MOS technology.
· Analyze electrical characterization data from DOE and corner lots to support optimization and validation.
· Support device characterizations, bench measurements, analyses and TCAD simulations.
· Define and draw new test key structures to evaluate layout-driven optimizations for the different technology enhancement projects.
· Run design/layout and process experiments for optimum semiconductor device performance.
· Use various troubleshooting techniques to isolate and solve technical issues with devices and processes.
· Work with failure analysis groups on field failures and customer returns to quickly isolate the problem and implement corrections.
· Present data, results, and conclusions in the technical team meeting.
What’s attractive about this opportunity?
- This position will strengthen your technical expertise through hands-on technology enhancement, device characterization, and process optimization.
- You will have the opportunity to work in an international team covering multiple aspects of the semiconductor industry.
Requirements/Qualifications:
· Strong knowledge of microelectronics, including Wafer Fabrication, Device Physics and TCAD simulations (Sentaurus).
· Familiar with Unix environment and with Cadence tools.
· Self-motivated, proactive, good communication and teamwork skills.
· Fluent verbal and written communication skills in English and French.
The New College Grade (NCG) candidate (less than 3 years of experience) must have a master’s degree or PhD with major emphasis on Semiconductor Devices.
Travel Time:
0% - 25%
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