Live opening · Posted 7 hours ago
At a glance
The key details from the original listing.
About the role
Description supplied by the original job listing.
Job Description
Lead PCB layout for automotive HPC and chiplet platforms, delivering manufacturable designs with design teams and external suppliers. Improve efficiency through AI-enabled automation, process and library management, and team mentoring.
Key Responsibilities:
Own multilayer/HDI placement, fine-pitch BGA escape, and routing from approved schematics and mechanical constraints through release.
Route DDR/LPDDR, PCIe, Ethernet, and SerDes to SI/PI constraints; implement power/ground, decoupling, and thermal/EMC requirements.
Coordinate design, SI/PI, mechanical, manufacturing teams, and external PCB suppliers on stack-ups, materials, vias, cost, reliability, and manufacturability.
Manage footprints, pad stacks, and ECAD libraries; improve request, naming, validation, approval, versioning, traceability, reuse, and obsolescence processes.
Lead layout/DRC and DFM/DFA/DFT reviews, resolve supplier issues, and release Gerber/ODB++, drill, stack-up, drawing, placement, and BOM data.
Mentor layout engineers; maintain layout guidelines and checklists, and guide application notes and customer presentations explaining trade-offs and risks.
Improve development handovers, reviews, change control, and release workflows using reusable practices, lessons learned, and supplier feedback.
Apply AI-assisted tools and scripting to layout checks, library verification, and documentation; validate outputs, protect design data, and measure cycle-time, quality, and rework improvements.
Qualifications
Bachelor’s degree in Electrical/Electronic Engineering or equivalent.
10+ years in complex high-speed PCB layout, with end-to-end ownership and design-team/supplier coordination; automotive experience preferred.
Expertise in multilayer/HDI stack-ups, BGA escape, microvias, via-in-pad, fabrication capabilities, and reliability trade-offs.
Strong DDR/LPDDR, PCIe, Ethernet, and SerDes routing skills: impedance, timing, differential pairs, crosstalk, return paths, and SI/PI.
Proficient in Cadence Allegro, Altium Designer, or equivalent; experienced in constraint management, libraries, and revision-controlled releases.
Knowledge of PCB fabrication/assembly, DFM/DFA/DFT, relevant IPC standards, and manufacturing deliverables.
Experience improving development/library processes and applying scripting, ECAD automation interfaces, and AI tools with validated efficiency gains.
Experience mentoring engineers and preparing layout guidelines, application notes, and customer technical presentations.
Soft skills
Results-oriented, structured, and quality-driven; strong analysis, root-cause problem-solving, and independent ownership.
Proactive collaboration across global teams and external suppliers.
Clear English communication, technical writing, and customer presentation skills.
Employment type
Full-time
Work arrangement
No
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