Group Leader – Die Attach & Underfill

Hiring for 3D Glass Solutions, Inc. — via Flexiple, the recruiting partner on this role.
About Company
3D Glass Solutions (3DGS) is a US advanced-packaging company using its patented photo-definable APEX® glass technology for RF, photonics, IC and system-in-package devices. Through its Indian entity, 3DGS is building a vertically integrated glass-core substrate and chip assembly plant in Bhubaneswar, Odisha, approved under the India Semiconductor Mission. The assembly team is small today, and the people who join now will select tools, qualify the line and build the teams that run it.
Job Roles & Responsibilities
Lead development, optimization and qualification of flip chip die attach, epoxy and film die attach, mass reflow, flux cleaning, plasma treatment, capillary underfill and cure for FCBGA, fcCSP and wbCSP products
Own combined process and equipment ownership for the module: process windows, tool qualification (SAT, IQ/OQ/PQ), equipment capability and module yield
Define and control critical parameters including bond force, temperature and dwell, placement accuracy, flux transfer, reflow profile, plasma conditions, underfill dispense and cure profile
Lead root cause analysis for defects such as non-wet opens, bridging, head-in-pillow, solder voids, die tilt, underfill voiding, delamination and die cracking
Set the substrate warpage strategy through reflow with package design
Qualify fluxes, underfills, epoxies and die attach films with suppliers
Build, train and certify the die attach and underfill team of engineers and technicians
Drive PM optimization, spares strategy and troubleshooting on bonders, reflow ovens, plasma systems, dispensers and cure ovens
Lead introduction of thermo-compression and laser-assisted bonding as those platforms are added
Ideal Candidate Profile
10+ years hands-on in flip chip die attach, die bonding and underfill at an OSAT, ATMP or IDM assembly site, owning multiple tool types
Engineering degree in Mechanical, Materials, Electrical, Chemical, Industrial or a related field
Part of at least one new line installation, qualification or capacity ramp
Has trained and certified entry-level engineers and technicians in a multi-tool production environment
Experience with SPC, DOE, FMEA, process characterization, yield analysis and structured troubleshooting
Prior leadership of engineers, technicians and cross-functional teams in a production or ramp environment
Willing to relocate to Bhubaneswar, Odisha
Strong grasp of solder joint metallurgy, copper pillar and C4 bumps, warpage through reflow and underfill flow mechanics
Experience with X-ray, C-SAM, cross-sectioning, die shear and fine-pitch low-standoff underfill is highly preferred
Originally posted on: 30 Sept 2026

Experience
10+ yrs

Work arrangement
No