IC Packaging and RF Simulation

Axiro Semiconductor is a fabless semiconductor design company headquartered in Bengaluru, driving innovation in RF, wireless infrastructure, satellite communication (Satcom), and high-speed connectivity solutions. Backed by CG Power & Industrial Solutions Ltd. part of the 120-year-old Murugappa Group. Axiro represents India’s leap into the global semiconductor arena. With millions of chips already powering global networks, a world-class team across India, the US, and Europe, and cutting-edge expertise spanning RF, mmWave, GaN, and next-generation communication technologies, Axiro is engineering the future of how the world connects, computes, and communicates.
For more details – www.axiro.com
Role Overview:
The IC Packaging and RF Simulation Intern will support the design, modeling, and optimization of advanced semiconductor packages and RF interconnect structures. The intern will work closely with Package Design, Signal Integrity (SI), Power Integrity (PI), and RF Engineering teams to analyze electrical performance, perform electromagnetic simulations, and contribute to the development of next-generation semiconductor products.
Key Responsibilities:
Perform electromagnetic (EM), RF, and signal integrity simulations for IC packages, substrates, and high-speed interconnects.
Develop and validate simulation models using tools such as Ansys HFSS, CST Studio Suite, ADS, and SIwave.
Analyze S-parameters, insertion loss, return loss, impedance discontinuities, crosstalk, and resonance effects.
Support package design optimization to meet electrical and RF performance requirements.
Correlate simulation results with laboratory measurements and characterization data.
Assist in package electrical model generation and validation.
Prepare technical reports, presentations, and engineering documentation.
Collaborate with Packaging, Design, Validation, and Manufacturing teams.
Required Qualifications:
Pursuing or recently completed a B.E./B.Tech/M.E./M.Tech in Electronics & Communication, Electrical, Communication, RF & Microwave Engineering, Semiconductor Technology, or related fields.
Basic understanding of Electromagnetic Theory, RF & Microwave Fundamentals, Transmission Lines, Signal Integrity (SI), Power Integrity (PI), and Semiconductor Packaging Concepts.
Preferred Skills:
Familiar with Ansys HFSS, CST Microwave Studio, Keysight ADS, Ansys SIwave, or Cadence AWR.
Exposure Wire Bond, Flip-Chip BGA, FC-CSP, WLCSP, or 2.5D/3D packaging.
Programming or scripting knowledge in Python, MATLAB, or VBA.
Understanding package substrates, PCB design, and high-speed interfaces.
Learning Opportunities:
Hands-on experience with semiconductor package design and RF simulation.
Exposure advanced package technologies and high-speed interconnect design.
Experience correlating simulation and measurement data.
Mentorship from experienced Package, SI/PI, and RF engineers.
Desired Attributes:
Strong analytical and problem-solving skills.
Effective communication and presentation abilities.
Ability to work in a collaborative engineering environment.
Passion for RF engineering, semiconductor packaging, and simulation technologies.
Preferred CGPA: 7.0/10 or above
Internship Duration: 6 months

Work arrangement
No