IC Package Process

Axiro Semiconductor is a fabless semiconductor design company headquartered in Bengaluru, driving innovation in RF, wireless infrastructure, satellite communication (Satcom), and high-speed connectivity solutions. Backed by CG Power & Industrial Solutions Ltd. part of the 120-year-old Murugappa Group. Axiro represents India’s leap into the global semiconductor arena. With millions of chips already powering global networks, a world-class team across India, the US, and Europe, and cutting-edge expertise spanning RF, mmWave, GaN, and next-generation communication technologies, Axiro is engineering the future of how the world connects, computes, and communicates.
For more details – www.axiro.com
Role Overview:
The IC Package Process Intern will contribute to the development and optimization of advanced semiconductor packaging technologies. This role offers an opportunity to work closely with Package Design, Manufacturing, Supply Chain, Quality, and OSAT partners to support new product introduction (NPI), process standardization, and continuous improvement initiatives. The intern will gain hands-on experience in assembly process development for cutting-edge semiconductor packages.
Key Responsibilities:
Collaborate with Packaging, Design, Manufacturing, Supply Chain, and Quality teams to support package development activities.
Assist in assembly process development and optimization for QFN, FCCSP, FCBGA, and module-based packages.
Support OSAT partners in new product introduction (NPI), process qualification, and manufacturing readiness activities.
Analyze process performance data to identify opportunities for yield improvement and defect reduction.
Participate in failure analysis, root cause investigations, and corrective action implementation for quality and reliability issues.
Support process characterization, validation, and standardization efforts across package assembly operations.
Prepare technical reports, presentations, and engineering documentation to communicate project progress and results.
Contribute to continuous improvement initiatives focused on manufacturing efficiency, process robustness, and product quality.
Required Qualifications:
Currently pursuing or recently completed a B.E./B.Tech/M.E./M.Tech/MSC in Electronics, Electrical Engineering, Materials Science, Semiconductor Technology, Applied Physics, or a related discipline.
Basic understanding of semiconductor devices, fabrication processes, and semiconductor packaging technologies.
Strong analytical, problem-solving, and data interpretation skills.
Proficiency in Microsoft Excel and PowerPoint; familiarity with statistical analysis tools
Learning Opportunities:
Gain hands-on experience in advanced semiconductor package development and assembly processes.
Work closely with industry experts, OSAT partners, and cross-functional engineering teams.
Develop practical knowledge of QFN, FCCSP, FCBGA, and module package technologies.
Learn semiconductor packaging process flows, qualification methodologies, yield analysis, and quality improvement techniques.
Exposure to new product introduction (NPI), process optimization, and manufacturing operations in a high-tech semiconductor environment.
Desired Attributes:
Strong analytical thinking and structured problem-solving approach.
Effective communication and presentation skills.
Ability to collaborate in a cross-functional and fast-paced engineering environment.
Eagerness to learn and adapt to new technologies and challenges.
Passion for semiconductor devices, packaging technologies, and manufacturing excellence.
Additional Information:
Preferred CGPA: 7.0/10 or above
Internship Duration: 6 Months
Career Opportunity: High-performing interns may be considered for a full-time employment opportunity upon successful completion of the internship, based on individual performance, business requirements, and role availability.

Work arrangement
No