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Service Engineer – Die Bonder / Semiconductor Equipment
About HCP Technologies Pvt. Ltd.
HCP Technologies Private Limited is a capital equipment supplier and OEM representation company founded in February 2024, headquartered in JP Nagar, Bengaluru. We represent over 32 global OEM brands across a wide range of high-growth verticals — Semiconductor, Additive Manufacturing, Photonics, Electronics Manufacturing (EMS), Battery Energy Storage Systems (BESS)/EV, and IoT/AI/ML.
We serve a diverse base of clients including IITs, IISc, CSIR, and ISRO, alongside leading private-sector manufacturers across India. Our team brings deep domain expertise — over 14 years of collective experience in capital equipment sales and marketing — to help customers access cutting-edge global technology.
Position: Service Engineer
We are looking for a Service Engineer with hands-on experience servicing Die Bonders or similar semiconductor assembly/packaging equipment (e.g., Wire Bonders, Pick-and-Place systems).
Job Description:
Install and commission Die Bonders and related semiconductor back-end equipment at customer sites across India
Perform routine preventive maintenance, calibration, and performance checks
Diagnose and troubleshoot mechanical, electrical, and software-related faults
Provide prompt breakdown support to minimize customer downtime
Liaise with global OEM principals for technical escalation, spares procurement, and firmware/software updates
Train customer operators and maintenance staff on proper equipment usage and basic troubleshooting
Maintain accurate service records, reports, and spare parts inventory tracking
Support pre-sales technical demonstrations when required
Requirements:
Diploma/B.E. in Electronics, Mechatronics, Instrumentation, or related field
Proven hands-on experience servicing Die Bonders, Wire Bonders, or similar semiconductor packaging/assembly equipment
Strong troubleshooting skills across mechanical, electrical, and software systems
Willingness to travel extensively for site visits across India
Good communication skills for customer-facing interactions
Why Join HCP Technologies?
Join a growing team supporting some of India's most advanced semiconductor and electronics manufacturing facilities, with direct exposure to leading global OEM technology and a real opportunity to build deep technical expertise in a high-growth sector.
📧 Interested candidates can apply directly or send their resume to lakshmishine@hcptech.in . Feel free to tag or share with someone who'd be a great fit!
#Hiring #ServiceEngineer #DieBonder #Semiconductor #FieldService #JobOpening #HCPTechnologies
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