Live opening · Posted 7 days ago

Mechanical Engineering

Metric DCX · Texas, United States (Remote)
Linkedin Yes
JobBeeper subscribers received an alert for this role.

At a glance

The key details from the original listing.

Posted 7 days ago
CompanyMetric DCX
LocationTexas, United States (Remote)
Work modeYes
SourceLinkedin
ListedPosted 7 days ago

Your early-applicant advantage

Live timing from JobBeeper.

Live data
11 min from Linkedin publishing this role to us finding it
309 min median time from a role going live to a subscriber being told
6 hours subscribers had this role before this page existed
53,695 roles found in the last 24 hours — the newest are not on this site yet
Start your free trial →

About the role

Description supplied by the original job listing.

Mechanical Engineer – Thermal & Liquid Cooling
Location: United States
Industry: AI Infrastructure / Data Centers
We are partnered with a rapidly growing AI infrastructure company building the physical systems required to support next-generation, high-density compute environments.
They are looking for an experienced Mechanical Engineer to join as a senior individual contributor, owning thermal and cooling engineering across both traditional air-cooled and advanced liquid-cooled infrastructure.
The Role:
Design and develop cooling solutions for high-density AI/data center environments.
Lead mechanical engineering across both air and liquid cooling systems.
Develop and optimize Direct-to-Chip (D2C) liquid cooling architectures.
Work with CDUs, liquid loops, heat exchangers, pumps, piping and associated thermal infrastructure.
Engineer air-side systems including CRAH/CRAC, chilled water and heat rejection systems.
Perform thermal analysis, system sizing, equipment selection and design reviews.
Work closely with electrical, controls, infrastructure and deployment teams.
Evaluate new cooling technologies as compute densities continue to increase.
Operate as a highly technical individual contributor with significant ownership over engineering decisions.
Requirements:
Strong mechanical/thermal engineering background within data centers, HPC, AI infrastructure or similarly high-density environments.
Direct hands-on experience with Direct-to-Chip liquid cooling is required.
Strong understanding of both liquid and air cooling technologies.
Experience designing mechanical cooling systems from concept through deployment.
Knowledge of CDUs, heat exchangers, pumps, piping, chilled water and heat rejection systems.
Comfortable operating independently in a fast-moving engineering environment.
This is an opportunity to take significant technical ownership within an early-stage infrastructure business tackling some of the most complex thermal challenges created by next-generation AI compute.

Work arrangement
Yes

Get JobBeeper Mobile App

Never miss a job opening! Get instant job alerts on your phone.

Subscribers see fresh openings within minutes. Download the JobBeeper App on Google Play to get real-time push notifications and apply before anyone else.

⚡ Instant Push Alerts 🎯 Tailored Filters 🚀 Direct Employer Links
GET IT ON Google Play

More openings worth a look

Recently tracked roles with full details and direct application links.

6 roles
Good roles move before most people even see them. Tell JobBeeper what you want and get fresh matches delivered in minutes.
Start your free trial →
⚡ Get fresh job alerts 📱 Get App