Live opening · Posted 7 days ago
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About the role
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Mechanical Engineer – Thermal & Liquid Cooling
Location: United States
Industry: AI Infrastructure / Data Centers
We are partnered with a rapidly growing AI infrastructure company building the physical systems required to support next-generation, high-density compute environments.
They are looking for an experienced Mechanical Engineer to join as a senior individual contributor, owning thermal and cooling engineering across both traditional air-cooled and advanced liquid-cooled infrastructure.
The Role:
Design and develop cooling solutions for high-density AI/data center environments.
Lead mechanical engineering across both air and liquid cooling systems.
Develop and optimize Direct-to-Chip (D2C) liquid cooling architectures.
Work with CDUs, liquid loops, heat exchangers, pumps, piping and associated thermal infrastructure.
Engineer air-side systems including CRAH/CRAC, chilled water and heat rejection systems.
Perform thermal analysis, system sizing, equipment selection and design reviews.
Work closely with electrical, controls, infrastructure and deployment teams.
Evaluate new cooling technologies as compute densities continue to increase.
Operate as a highly technical individual contributor with significant ownership over engineering decisions.
Requirements:
Strong mechanical/thermal engineering background within data centers, HPC, AI infrastructure or similarly high-density environments.
Direct hands-on experience with Direct-to-Chip liquid cooling is required.
Strong understanding of both liquid and air cooling technologies.
Experience designing mechanical cooling systems from concept through deployment.
Knowledge of CDUs, heat exchangers, pumps, piping, chilled water and heat rejection systems.
Comfortable operating independently in a fast-moving engineering environment.
This is an opportunity to take significant technical ownership within an early-stage infrastructure business tackling some of the most complex thermal challenges created by next-generation AI compute.
Work arrangement
Yes
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